World’s first MOSFET Relay introduced for semiconductor wafer test system

OMRON Corporation has globally released its new MOSFET relay module “G3VM-21MT”. The product is the first electronic component in the world to adopt a “T-type circuit structure”. With T-type circuit structure consisting of compact size and longer lifecycle solid state relays that output signals using no physical contact, the relay module minimizes the leakage current which has long been a problem with semiconductor test equipment. G3VM-21MT allows high-precision measurement and improves productivity of electronic components.

G3VM-21MT enables switching measurement signals in the test equipment mainly used to perform electrical tests for semiconductor devices. In addition to the MOSFET relay features of compact size and longer lifecycle, G3VM-21MT is the world’s first MOSFET relay Module with “T-type circuit structure” which consists of three MOSFET relays that help reduce the leakage current to a minimal level without affecting the test equipment’s inspection accuracy while allowing high-precision measurement and decreasing maintenance frequency of the test equipment.

Amid the digital age where functions of electronic components are getting diversified and production volume increasing, there is a growing need for higher performance of semiconductor test equipment. Mechanical reed relays, which have been used for a part that performs high-precision measurement in semiconductor test equipment, have extremely low leakage current but they require replacement on a regular basis, maybe several times for every single month due to wear and abrasion of the contacts that lead to affecting the measurement accuracy. Such maintenance work may substantially affect the production efficiency, so adoption of solid-state relays has been long desired as its longer lifecycle. So far, MOSFET relays are considered not suitable for precise electrical tests due to technological difficulty to reduce the leakage current in relation with its feature and were not used in test equipment which requires high reliability.

To meet these needs, by utilizing OMRON’s technologies of electronic components cultivated over many years, we succeeded in commercializing the relay module product by adopting the “T-type circuit structure” and significantly reducing the leakage current lower than or equal to 1pA(one trillionth part of the ampere). The challenge in reducing the leakage current in a solid-state relay as close to zero as possible eliminates the leakage current problem and improves test equipment reliability. Moreover, by integrating long life MOSFET relays into the relay module, it allows for shorter downtime for maintenance which have been a long-standing challenge for mechanical relays. With the launch of G3VM-21MT, OMRON will strive to contribute to the improvement in productivity of electronic components and support the evolution of digital transformation in society.

Features

  1. High equipment reliability by reducing leakage current to 1pA or lower

  2. Leakage current has been a long-term disadvantage of semiconductor relays and G3VM-21MT helps solve the problem by minimizing the leakage to 1pA or lower.
    G3VM-21MT successfully achieved actual performance of lower than or equal to 0.1pA level while minimizing the impact on measurement accuracy of the application.
  3. Longer lifecycle and significant decrease in maintenance frequency

The output circuit of G3VM-21MT relay module consists of semiconductor MOSFET relays using no physical contact, hence no need to perform maintenance on the contacts for wear or abrasion as there will be no arc discharge generated from opening and closure of the circuit.

  1. Reduced mounting space – high-density mounting by space-saving and wire-saving

    G3VM-21MT achieves compact size of 5mm×3.75mm×2.7mm by incorporating the complex wiring diagram of input and output circuits into the internal module, ultimately simplifying PCB wiring of the application.

For more information, visit: www.omron.com

SHARE
Previous article33rd Edition of VLSI Design Conference
Next articleIncreasing system update with the brand new isolated silicon carbide gate driver
ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

LEAVE A REPLY