New LFPAK56D MOSFET Line-Up With AEC-Q101-Qualified Half-Bridge Package
Nexperia announced a series of half-bridge (high side & low side) automotive MOSFETs constructed in the space-saving LFPAK56D package format. The half-bridge configuration of two MOSFETS...
New Automotive Smart Camera Development with Open Platform Turnkey Solutions
Renesas announced the EagleCAM module, an open front camera solution, featuring Renesas’ R-Car V3H and R-Car V3M system-on-chip (SoC) devices. The all-in-one scalable camera platform targets the latest...
Industry’s First EPS-FB Test for 5G New Radio
Anritsu Corporation is pleased to announce that the first EPS-FB Protocol Conformance test for 5G NR has been verified on the 5G NR Mobile...
The First No-Code Voice AI Platform for Microcontrollers
Picovoice announces the public availability of Shepherd: the first no-code platform for building voice interfaces on Microcontrollers. Shepherd enables creating voice experiences similar to...
New Electronic City to be build by UP Government
The Uttar Pradesh government has announced an Electronics City on a 700-acre land parcel adjacent to the site of the Noida International Airport in...
NXR-Series IO-Link Product Line with I/O Hub Solutions for Industry 4.0
Maxim Integrated announced that its dual IO-Link® products have been adopted by OMRON Corporation for the company’s NXR-Series IO-Link Controller and IO-Link I/O hubs,...
Dixon and Nokia Shook Hands for Manufacturing Smartphones in India
Padget Electronics, a subsidiary of Dixon Technologies, has entered into a partnership to manufacture Nokia smartphones in India for HMD Global.
The company with sheer...
Industry 4.0 Technology: Revolutionizing Indian Manufacturing Sector
Industry 4.0 is already influencing sectors like manufacturing, supply chain management, construction, shipping, etc., and shall impact all the aspects of our day-to-day activities....
