The SIPLACE TX micron is the answer to the challenges manufacturers face in SiP (system-in-package) production. The flexible platform combines the speed of SMT assembly with the complexity of die processing. The new version of the pick-and-place machine has been significantly improved by market...
In a recent announcement, the Union Minister for Electronics and IT, Ashwini Vaishnaw, disclosed that India is poised to witness the establishment of three...
In a significant development for embedded and edge computing technology, Congatec has introduced six cutting-edge computer-on-modules—specifically, the conga-TC675r COM Express Compact modules. Powered by...
In recent years, there has been an explosive demand for high-resolution, bandwidth-hungry imaging technologies that integrate Artificial Intelligence (AI) with an increased focus on...
Embarking on the integration of Artificial Intelligence (AI) at the edge presents a promising frontier but comes with its share of complexities. The synergy...
