More

    Speed and Precision for SiPs

    The SIPLACE TX micron is the answer to the challenges manufacturers face in SiP (system-in-package) production. The flexible platform combines the speed of SMT assembly with the complexity of die processing. The new version of the pick-and-place machine has been significantly improved by market...

    Congatec Launches Ultra-Rugged Computer-on-Modules for Harsh Environments

    In a significant development for embedded and edge computing technology, Congatec has introduced six cutting-edge computer-on-modules—specifically, the conga-TC675r COM Express Compact modules. Powered by...