Hua Hong Semiconductor celebrates 5 Million shipment mark of MOSFET

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Hua Hong Semiconductor Limited a global leading pure-play 200mm foundry, announced that its power discrete platform has crossed the shipment mark of 5-million wafers. Thanks to the strong market demand for Super Junction MOSFET(“SJNFET”) and IGBT, Hua Hong Semiconductor has so far delivered 200,000 wafers of its unique and competitive vertical trench SJNFET and 30,000 wafers of Field Stop (“FS”) IGBT, which are still increasing rapidly.

Power discrete that plays a more and more instrumental role in such areas as mobile communications, consumer electronics, switched mode power supply (“SMPS“), motor driver, LED driver, new energy vehicle (“NEV”) and smart grid represents a core device to lower power consumption and improve efficiency. With a 15-year proven track record in volume production of power discrete, Hua Hong Semiconductor is the first and largest 200mm foundry in the world for power discrete.

Remaining on track of R&D and innovation, the Company, with its highly competitive semiconductor technologies, delivers a full spectrum of solutions ranging from high voltage (“HV”) to low voltage (“LV”) to customers, and is extending to higher-end and higher-density categories for more potential applications, to consolidate its strategic vision as a “global power discrete leader”.

Equipped with industry-leading technical parameters, the Company’s third-generation SJNFET process platform delivers solution to customers featuring lower on-resistance, smaller chip size, faster switching speed and lower switching loss. Hua Hong Semiconductor is Mainland China’s only foundry with a full range of wafer backside processing technologies, delivering FS IGBT with technical attributes comparable to those from international leaders.

“The 5 millionth shipment mark of MOSFET represents a major milestone of Hua Hong Semiconductor. More and more power system designers are seeking from us the leading power management foundry solutions for green energy, fast charging and industrial applications.” Said Mr. Fan Heng, Executive Vice President of Hua Hong Semiconductor, “Committed to delivering chips that empower sustainability, we will focus on the entire industrial chain of NEV, covering charging pole, battery protection and motor drive applications and others. Besides, we are accelerating R&D on ultra-high-voltage IGBT technologies for premium industrial applications, which, as anticipated, will further consolidate our leadership in the power discrete field.”

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