Buy at Mouser: Speed IoT Time to Market with Digi ConnectCore for i.MX6UL Development Kit

Mouser Electronics, Inc., is now stocking the Digi ConnectCore for i.MX6UL Development Kit. The kit is a complete, off-the-shelf single board computer (SBC) built on the ConnectCore for NXP i.MX6UltraLite applications processor and designed specifically for rapid development and prototyping of a secure gateway platform for intelligent connected devices. It enables more efficient, rapid delivery of connected products and applications requiring multiple access points, offering the highest levels of reliability and flexibility while facilitating development of key areas — including display capabilities — essential for powering today’s advanced Internet of Things (IoT) and machine-to-machine (M2M) solutions.

The Digi ConnectCore for i.MX6UL Development Kit, available from Mouser Electronics, delivers a complete software platform that requires little to no hardware development to create a wide range of connected devices. The SBC is built on the ConnectCore 6UL system-on-module (SOM) with a low-power NXP i.MX6UL application processor, 256 MBytes of flash, 256 MBytes of RAM, dual 10/100 Mbit Ethernet, pre-certified dual-band 802.11ac wireless LAN, Bluetooth 4.2 connectivity, NFC tag capabilities, and complete set of available peripherals. The SBC also features a Digi XBee socket that supports the broad line of Digi XBee RF modules, 4-bit LVDS and RGB parallel LCD support (up to WXGA), camera, and SD card storage.

The kit includes all functionality on one board and allows designers to address all development needs, including a proven reference design for module-based development, a rapid prototyping platform for quickly creating proof-of-concepts, and a platform to quickly bring fully developed intelligent connected products to market. As compared to Digi ConnectCore for i.MX6UL Starter Kit, the SBC in the Development Kit is focused on the creation of connected smart gateway capabilities, including those requiring more flexible implementation options such as integration of multiple wireless technologies, or LCD and camera support.

For more information, visit