Webinar Alert: ANSYS 18 Pervasive Engineering Simulation

Today’s industries are undergoing the most fundamental transformation in manufacturing since the introduction of the assembly line more than a century ago. Trends like the Internet of Things, additive manufacturing and machine learning are merging the physical world and the digital world, resulting in products that defy imagination. As products become smarter, companies are also changing the way they manufacture and operate products. These changes require pervasive engineering simulation, in which simulation performs a central role in all aspects of the product lifecycle — from concept, through engineering design and into operations.

Engineers can save time and money by performing simulations earlier in the design cycle, using digital exploration to explore a larger design space faster before making design decisions and locking in costs. Similarly, simulation is moving downstream into operations, where real-time simulation using digital twins is providing insight into a product’s real-world performance and maintenance. ANSYS 18 is our next step in delivering pervasive engineering simulation. Placing simulation into the hands of more engineers throughout the product lifecycle.

Join us for our upcoming webinars to know more about ANSYS 18.

Theme: ANSYS 18 Innovations – Electronics Cooling

Date:  March 21, 2017
Time: 11:30 hrs IST
Duration: 60 min

ANSYS 18.0 delivers innovative new solutions for electronics cooling. Thermal integrity is a critical design consideration for enclosure design, packages, and PCBs that affect reliability and product lifecycle. Thermal impact on the package, especially from the IC, is a key driver for material selection, cooling and form factor decisions that ultimately determine the size, weight and cost of the final product. It is critical for package and system designers to determine the thermal signature of their system.

Attend this webinar to learn about important new capabilities in ANSYS 18.0 regarding electronics cooling simulation, such as importing chip thermal models (CTM) from ANSYS RedHawk to ANSYS Icepak for thermal analysis of the complete IC, package and PCB. Designers of high-speed digital electronics, and thermal and mechanical engineers involved in electronic design should attend this informative webinar on electronics cooling analysis.

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Theme: ANSYS 18 Innovations – High-Frequency Electromagnetics

Date: March 30, 2017
Time: 11:30 hrs IST
Duration: 60 min

High-frequency, high-speed electronic devices are increasingly critical for microwave, RF and high-speed digital applications. ANSYS HFSS software is the industry standard for simulating 3-D, full-wave, electromagnetic fields for such applications. Its state-of the-art solver technologies based on finite element, integral equation, asymptotic and advanced hybrid methods are essential tools for engineers tasked with executing accurate and rapid design of high-frequency electronic devices.

Attend this webinar to learn about the latest innovations in ANSYS HFSS 18.0, including a new streamlined antenna workflow with an enhanced antenna design kit, broadband adaptive meshing for improved accuracy and reliability, and the integration of our Delcross Savant technology into the new HFSS SBR+ (shooting and bouncing ray) workflow. Discover new productivity enhancements such as breakthrough HPC technology for faster and more memory-efficient frequency sweeps, and advances in 3-D component technology that provide a powerful collaborative platform for EM simulation

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