COMSOL, Inc. the leading provider of software solutions for multiphysics modeling, simulation, app design, and deployment, will be featured at the 2nd Thermal and Fluids Engineering Conference (TFEC). With a focus on “Engineering Challenges for the Betterment of Society”, this year’s conference will provide an international forum for discussing the latest research and development achievements in the thermal and fluid sciences and the impact on numerical simulation. Svante Littmarck, President, and CEO of COMSOL, Inc., will give a plenary lecture on the latest achievements of multiphysics simulation. COMSOL will also offer the attendees a course on “Multiphysics Simulation of Thermal and Fluid Systems”.
Custom simulation apps bring new opportunities
“Thanks to custom simulation apps, powerful computational tools are able to reach a wider group of users than ever before,” says Svante Littmarck. “During the lecture, I will discuss use cases and show how state-of-the-art multiphysics software can be used to benefit simulation specialists, their colleagues, and customers alike.” The adoption of apps is spreading quickly across industry and academia supported by the ease of use of the Application Builder in the COMSOL Multiphysics software and cost-effective deployment through a local installation of the COMSOL Server product.
Cornell University is an example where large scale deployment of apps through COMSOL
Server benefits students and teachers nationwide without them having to directly invest in the software or hardware. “Simulation apps bring new opportunities to education,” says Prof. Ashim Datta, Department of Biological & Environmental Engineering, Cornell University. “In a food safety class, apps enable multidisciplinary learning where students of biological science can simulate many what-if scenarios realistically.”
Littmarck concludes, “Engineers can benefit from powerful mathematical modeling tools and solver technology in COMSOL Multiphysics and deliver custom apps with COMSOL Server™. Deploying apps to their organization and customers worldwide has never been more straightforward.”
Multiphysics Simulation of Thermal and Fluid Systems
COMSOL will offer a course on “Multiphysics Simulation of Thermal and Fluid Systems”. David Kan, vice president of sales for the southwestern region of the US, and Nicolas Huc, Technical Product Manager, Heat Transfer, will introduce the participants to multiphysics simulation using the COMSOL software. The course will focus on the design of a heat sink to demonstrate how to model conjugate heat transfer step-by-step. Engineers and scientists are turning to the accuracy of multiphysics modeling software to optimize their designs and for a deeper understanding of processes involving fluid flow and heat transfer.
The ability to model conjugate heat transfer, alongside other physics, with high-fidelity is of the essence as it’s the main physics phenomena driving ubiquitous processes and components such as heat exchangers, thermoelectric coolers, bio heating devices, laser heating, thermal lensing, electronic cooling, induction heating, and RF heating.