Acquisition of new automatic die bonder to keep up with rapid growth

In our continued strategic pursuit of excellence and improvement, Innovations in Optics, Inc. has purchased a new F&S BONDTEC Model 5830 automatic wire bonder...

New soft structural color robot interacts and familiarizes with the environment

A research team of Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences have discovered a soft robot, which can change its color and...

Unveiling the world’s first surface-mount flip-chip back-emitting VSCEL Array

TriLumina, the leading developer of flip-chip VCSEL (vertical-cavity surface-emitting laser) technology for 3D sensing, announces the launch of the world’s first surface-mount flip-chip back-emitting...
semicon crystals_main

Sphere of light explores semiconductor crystals for energy savings

A new technique has been developed by research scientists of Tohuku University, which uses a hollow sphere to measure the electronic and optical properties...
Solar cells_main

Dye-sensitized solar cells: Today’s most efficient solar technology

A popular type of dye-sensitized solar cell developed by research scientists at Kyoto University. The newly-made solar cell is more efficient by adjusting and...

Ideal 2D transistors created from ultra clean damage free fabrication platform

An ideal transistor made from a 2D material stack has been demonstrated by the Columbia Engineering researchers. The material stack is made with only...

PicoQuant’s Quantum Symposium portrays astonishing areas of quantum photonic technologies

From May 22 to 24, 2019, PicoQuant held its second international symposium on “Single Photon Based Quantum Technologies” in Berlin. The three-day event brought...
photonics main

Graphene electronics to pave the way with the new ‘Laser Shock’

A new technique named laser shock imprinting has been used by researchers from Purdue University, the University of Michigan and the Huazhong University of...
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