Octavo Systems, the leader in System-in-Package (SiP) technology, announced, the most completely integrated 1GHz Arm Cortex-A8 computing platform, the OSD335x C-SiP. The OSD335x C-SiP (Complete System-In-Package) integrates the required components for a computing system into a single IC package that is about the size of a standard Lego block.
The newest addition to the OSD335x family, the OSD335x C-SiP is a complete system containing the 1GHz Arm Cortex-A8 Sitara AM335x processor from Texas Instruments, up to 1GB of DDR3 RAM, 4KB EEPROM, 2 Power Supplies, up to 16GB of eMMC Non-Volatile Flash Memory, a MEMS Oscillator, and over 100 passive components into its single 27mm X 27mm 400 Ball BGA Package.
“The addition of the eMMC and the Oscillator to the processor, ram, and power supplies, makes the OSD335x C-SiP a complete system. It has everything you need for a powerful Linux computer integrated into a small, easy to use package. All you need to do is add power and a couple of resistors. That is why we call it a Complete System-In-Package.” says Gene Frantz, CTO of Octavo Systems.
Besides simplifying the design of an embedded system, the OSD335x C-SiP is also about 50% smaller than an equivalent system built with individual components. This allows designers to shrink their designs, save cost on their PCBs, or add processing power to form factors that weren’t possible before.