CEA, Soitec, GlobalFoundries and STMicroelectronics have announced a new collaboration in which they intend to jointly define the industry’s next-generation roadmap for FD-SOI (fully depleted silicon-on-insulator) technology. Semiconductors and FD-SOI innovation are of strategic value to France and the EU as well as to customers globally. FD-SOI offers substantial benefits for designers and customer systems including lower power consumption as well as easier integration of additional features such as connectivity and security, a key feature for automotive, IoT and mobile applications.
“CEA has been, for over 20 years, a pioneer of the FD-SOI technology, within the Grenoble-Crolles ecosystem. CEA has also a long history of deep R&D cooperation with both STMicroelectronics, Soitec and GlobalFoundries and has been very active in the initiatives led by the European Commission and Member States aiming to set up a complete ecosystem for FD-SOI going from material suppliers, design houses, EDA tools providers, fabless companies and end-users”, said François Jacq, CEA Chairman. “CEA is highly motivated by this opportunity to prepare a new generation of FD-SOI technology providing higher performance, lower power consumption and lower costs to address the needs of major European markets such as automotive, IoT, 5G/6G and manufacturing 4.0.”
“FD-SOI is a key technology for the dynamic markets we address and an important growth driver for our industry and our customers,” said Paul Boudre, CEO of Soitec. “The FD-SOI alliance that we are pleased to announce today is built on Soitec’s capacity to drive innovation in substrates and help launch a new generation of semiconductors serving a large variety of markets including connectivity, automotive, Internet of Things and Artificial Intelligence. Together with our partners and allies, we want to confirm our technological leadership and continue to drive innovation in global microelectronics. This collaboration also illustrates how closely we work with our customers to advance technologies, address their future needs, and accompany them to go to market at a high pace.”
“We look forward to deepening our partnership with the leading French and European stakeholders across the full semiconductor value chain and in particular to build on our highly differentiated FDSOI-based solutions together to address the rapid growth of chips requiring low power, connectivity, and security in automotive, IoT and smart mobile devices,” said Tom Caulfield, CEO of GlobalFoundries. “The dynamic European semiconductor ecosystem is important to us and we will continue to invest to grow our presence in the EU as part of our global growth strategy.”
For more information, visit www.st.com