IPC Compliant THT Solder Joint Inspection of Automotive Connectors

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Latest Electronics products NewsThe X-ray inspection system X Line 3·D from GOEPEL electronic enables reliable inspection of THT and Pin-in-Paste solder joints in compliance with the IPC quality standard through a unique combination of 3D X-ray (AXI) and 2D AOI inspection. That is particularly important for automotive assemblies which are subject to strict quality requirements.

Unlike simple two-dimensional X-ray inspection, 3D X-ray inspection allows evaluation of the solder penetration for THT connectors. Assemblies which are subject to the IPC norm must show a solder penetration of 50 to 75 percent at the pin, depending on the IPC class. These requirements can be assured through evaluation of the solder penetration layer by layer. The limits of X-ray technology in this particular application are, however, the requirement of circumferential wetting of pins and the wetted connecting surface (ring). As an example, according to the IPC, the circumferential wetting must be proven to be between 270° and 330°. Only the combination of two technologies can provide compliance with this standard. By using a fully integrated and automated AOI module, both circumferential wetting and wetted connecting surface can be evaluated at the solder side.

With the X Line 3·D and the AXOI technology (combined X-ray and optical inspection), maximum fault coverage at line cycle times can be achieved. By scanning image acquisition, time-efficient quality control is made possible.  Hole fill levels, pin and pad wetting, bridging and solder balls can be detected with one single system. The X Line·3D is an inspection system for the safe testing of double-sided assembled PCBs. The three-dimensional X-ray inspection covers both top and bottom sides within a continuous process. The basis of this technology is real-time multi-angle image acquisition, which allows a complete 3D capture of the assembly. Integrated reconstruction methods based on planarGT provide detailed evaluation of the PCB under test layer by layer.

About GOEPEL electronic:

GOEPEL electronic is a technologically leading vendor of professional Automated Optical Inspection systems (AOI) and Automated X-ray Inspection Systems (AXI). A network of branch offices in the UK, China, India and the USA, international distributors and service partners ensures the global availability of the products as well as the on-site support to several hundred system installations. Founded in 1991 and headquartered in Jena, Germany, GOEPEL electronic has currently more than 230 employees and generated revenue of 30 million Euro in 2015 (approx. $32 million). GOEPEL electronic has continuously been ISO9001 certified since 1996 and has been honoured with TOP-JOB and TOP-100 awards for being one of the best medium-sized companies in Germany. GOEPEL electronics’ industry award winning products are relied on by the leading companies in telecommunication, automotive, space and avionics, industrial controls, medical technology, and other industries. Further information about the company and its products can be found on the internet at www.goepel.com.

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