Electrolube Debut New Thermal Interface and Resin Solutions at LED Expo India

    Electrolube, the established global manufacturer of electro-chemicals, will launch the newest encapsulation resin systems and thermal management materials for India’s LED manufacturers at this year’s LED Expo, held at the Pragati Maidan in New Delhi, from 2-4 December.

    Electrolube’s new innovations meet the ever increasing demands of the rapidly growing LED market, to fully maximise LED performance and lifetime, and ensure the desired results for heat dissipation are achieved. New products on show will includeER2224, which provides high thermal conductivity and excellent thermal cycling performance, making it ideal for use in LED lighting units where it helps to promote heat dissipation and prolong unit service life. The thermally conductive epoxy resin system offers an improved method of cure and subsequent health and safety benefits for the user.

    The tough new UR5638 polyurethane resin provides a clear, transparent finish and is a low exotherm resin, making it ideal for LED applications involving the encapsulation of larger LED lighting units. As an aliphatic polymer, the resin also offers superior UV stability as well as excellent transmission of visible light, making it an excellent resin for white light LEDs.

    UR5639 has been designed to encapsulate a variety of electrical components, but is particularly suited to LEDs. UR5639 is a clear/transparent polyurethane resin featuring low exotherm, low viscosity, low hardness and high flexibility. The level of flexibility achieved by the cured resin means that the connecting legs of components are not placed under high levels of stress during the cure.

    Electrolube will also launch two new silicone-free thermally conductive phase change materials. TPM350 provides low thermal resistance, excellent reliability and is exceptionally easy to apply. The material is similar to grease but without the mess and pump-out and is also dry to the touch, which is particularly useful for pre-apply applications. The TPM550 material features high thermal conductivity of 5.5 W/m.K and becomes workable at approximately 45°C. Its advanced formulation ensures minimal contact thermal resistance and TPM550 also produces no mess due to its thixotropic characteristics, which prevent flow outside of defined interfaces.

    Designed for use between heat generating components and heat sinks, the highly flexible GP300S and GP500S Thermal Gap Pads provide excellent thermal conductivity with a wide operating temperature range from -50 to +160. Both gap pads are ideal for applications where rapid and efficient heat removal is required and can be cut to any size. GP300S provides thermal conductivity at 3.00 and GP500S provides higher thermal conductivity at 5.00.

    Ron Jakeman, Managing Director of Electrolube, comments, “We are delighted to return to the Led Expo. In previous years, Electrolube has been actively sought out at the show to help local manufacturers find thermal solutions for their requirements.Since setting up our sales facility in India 4 years ago and more recently opening our state-of-the-art manufacturing facility in Bangalore, Electrolube is fast becoming the first point of contact for thermal interface solutions in India. It is a very dynamic time for us and indeed for materials innovation in the LED market. Having a direct presence in the country is enabling us to have immediate contact with the market and provide first rate technical support to critical market sectors. With LED applications becoming more diverse and challenging, we are looking forward to the responses from visitors to our new LED protection solutions, which uniquely combine the desired aesthetic affect with the practical capacity to extend reliability and lifetime of the LED product.”

    Visitors are welcome to meet Electrolube’s experts on stands K95 and K105 at LED Expo for advice about their applications and suitable product selection.

    Electrolube’s new brochure for LED solutions can also be found online at

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