Alliance Memory Expands Its Lineup of Low-Power SRAMs With New 64Mb Device in TSOP-I Package

1007

 To meet the demand for low-power SRAMs with higher densities, Alliance Memory today introduced a new 64Mb (4M x 16 bit) device in 48‑pin, 12mm by 20mm TSOP-I and 48-ball TFBGA packages. Available from a very limited number of suppliers, the AS6C6416-55 operates from a single power supply of 2.7V to 3.6V and offers a fast access time of 55ns.

The device released today features low power consumption with a typical operating current of 12mA and standby current of 12µA. The IC provides high reliability and power savings for low-power portable electronics and industrial automation, telecom, medical, and broadcast equipment, and is particularly well-suited for battery backup non-volatile memory.

The AS6C6416-55 is fabricated using very high-performance, high-reliability CMOS technology, and its standby current is stable within the operating temperature range of -40°C to +85°C. The RoHS-compliant device offers fully static operation and tri-state output, and it features a data retention voltage of 1.2V minimum. All inputs and outputs are fully TTL-compatible.

The new IC provides a reliable drop-in, pin-for-pin-compatible replacement for a number of similar solutions. The AS6C6416-55 is the latest in the company’s full range of low-power SRAM products, which include devices with densities of 64K, 256K, 1M, 2M, 4M, 8M, 16M, 32M, and now 64M.

Link to product datasheet and ordering information:
https://www.alliancememory.com/as6c6416/ (AS6C6416-55TIN, TSOP-I)

Samples of the AS6C6416-55TIN are available now. Production quantities — including a version of the 48-ball TFBGA package, AS6C6416-55BIN — will be available in Q4 2017, with lead times of eight weeks.

SHARE
Previous articleHARTING Offers Ideal Solution for the Agricultural Sector
Next articleVisit OMRON’s futuristic automation solutions at the Automotive Engineering Show

LEAVE A REPLY