All new Bluetooth LE 5 transceiver announced for automotive applications

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Toshiba has announced an automotive Bluetooth Low Energy (LE) core specification 5.0 chip for automotive applications such as including remote key-less entry, on-board diagnostics and tire pressure monitoring systems.

TC35681IFTG is based around an Arm Cortex-M0 CPU, and is designed for compliance with AEC-Q100. The mixed-signal device contains both analog RF and base-band digital parts and comes in a 6 x 6mm QFN40 wettable flank package, wettable flanks east visual inspection in high-reliability applications.

Alongside basic functions such as Host Control Interface (HCI) profile and GATT profile, new functions as defined by Bluetooth core specification 5.0 are provided including 2Mbit/s data, long range (with +8dBm PA, link budget is 113dB at 125kbit/s in long range operation) and advertising extension, all stored in internal mask ROM.

Operation is over -40°C to +125°C and 1.8V to 3.6V, an on-chip dc-dc converter provides internal needs. Consumption is 50nA in deep sleep mode, 11mA when transmitting and 5.1mA when receiving.

“The IC is typically used in combination with an external host processor connected via an HCI,” said the firm. “It can also operate in conjunction with an external non-volatile memory, loading the application software into the internal RAM (76kbyte) and executing the program using its Arm Cortex-M0 CPU.”

18 GPIO lines are available as are SPI, I2C serial interfaces a two-channel 921.6kbit/s UART. Extra GPIO line functions include wake-up, four channels of PWM and five channels of ADC.

 

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