Digi International, a leading global provider of Internet of Things (IoT) connectivity products and services, announced that it will highlight its Digi ConnectCore 8M Nano system-on-module (SOM) development kit and the Digi XBee Ecosystem of wireless networking modules, software, tools and services at Embedded World 2020.
Digi will host demonstrations and participate in educational sessions illustrating its award-winning embedded technology capabilities. Embedded World takes place in the Exhibition Centre Nuremberg, February 25-27. Digi will be in Hall 3, booth 225.
“Digi has long looked at Embedded World as a launch pad for our most important embedded products and software. We’re excited to continue that tradition as we launch our ConnectCore 8M Nano kits this year,” said Mark Tekippe, Director of Product Management, Digi International.
Award-winning IoT products and services
The Digi ConnectCore 8M Nano expands Digi’s i.MX SOM portfolio, complementing the ConnectCore 6 and ConnectCore 8X families and delivering customers a scalable platform that covers a wide range of applications, performance and price points.
The Digi ConnectCore 8M Nano Development Kit simplifies embedded product development and enables manufacturers to get to market faster. The kits are the result of Digi’s valued position as an Early Access Partner for NXP’s latest i.MX 8M Nano applications processor, which was first announced in December. The ConnectCore 8M Nano features pre-certified wireless connectivity, an integrated device security framework, remote management, cloud integration and a complete Linux software platform based on Yocto Project.
Digi will demonstrate its award-winning Digi XBee wireless networking solutions, its complete line-up of Digi ConnectCore SOMs and Digi Remote Manager, a comprehensive IoT device monitoring application for secure asset monitoring and control.
Following its recent acquisition of Opengear, Digi will also feature a range of critical IT infrastructure products and software, including failover-to-cellular and out-of-band management solutions. Together with the XBee and ConnectCore brands, these products enable Digi to deliver a comprehensive hardware-enabled, software-defined IoT and network technology portfolio.
Digi On-Booth Demonstrations:
Secure, Managed, Multiprotocol IoT Connectivity with Digi XBee
Digi will present the latest advancements in Digi XBee 3 wireless IoT networking solutions including multi-protocol support (Zigbee/802.15.4, LTE-M/NB-IoT Cellular, Bluetooth), remote management and integrated MicroPython edge compute capabilities.
Develop, Build, Deploy and Manage with Digi XBee Tools
Digi will demonstrate its complete suite of Digi XBee tools which accelerate time-to-market and enable customers to easily develop, build, deploy and manage wireless networks at scale.
Real-Time Image Processing and Classification with Digi ConnectCore 8X
Digi will showcase an optimized, embedded vision system with edge-based, machine learning to implement quality control in real-time. Based on Digi ConnectCore 8X SOM and Au-Zone’s DeepView machine learning tools, we will demonstrate how machine learning anomaly detection can be implemented using 50-100 images captured with a cellphone.
Machine Learning-based Gesture Control in the NXP Booth: Hall 4A | Stand 4A-220
This demonstration features an interactive machine learning-based gesture control using GPU and OpenCL for edge detection. It leverages Digi’s scalable ConnectCore family based on NXP’s i.MX 8X and graphics powered by SnapUI.
Graphics Performance Demonstration of Digi ConnectCore 8X + ByteSnap SnapUI
Digi will be displaying the complex graphics performance of the Digi ConnectCore 8X powered by ByteSnap’s SnapUI. The demonstration will show live CPU loading utilizing a lightweight UI framework that simplifies OpenGL development.
For more information, visit: www.digi.com