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    Cutting-Edge AI Computing Unleashed with Latest COM Express Compact Modules

    In a significant leap forward for embedded and edge computing, a leading provider of technology in this space is unveiling its latest series of COM Express Compact modules featuring the groundbreaking Intel Core Ultra processors. These modules, equipped with a blend of CPU, GPU, and NPU compute engines, are poised to redefine the landscape for running demanding AI workloads at the edge.

    The COM Express Compact modules boast a unique architecture, leveraging powerful P-cores and efficient E-cores for general computing, along with the high-performance Intel Arc GPU designed for graphics-intensive tasks. Adding to this impressive lineup is the integrated Neural Processing Unit (NPU) known as Intel AI Boost, which provides advanced neural processing capabilities to the overall computational framework.

    The incorporation of the NPU is a game-changer, enabling the seamless integration of advanced AI workloads with reduced system complexity and costs compared to discrete accelerators. This development positions the Intel Core Ultra processor-based Computer-on-Modules as an optimal choice for applications demanding high-performance real-time computing coupled with robust AI capabilities. Industries such as surgery robotics, medical imaging, diagnostic systems, and industrial applications like inspection systems, stationary robotic arms, autonomous mobile robots (AMRs), and autonomous guided vehicles (AGVs) stand to benefit significantly.

    Tim Henrichs, VP of Global Marketing & Business Development at Congatec, emphasizes the ease of integration and application readiness offered by the new conga-TC700 COM Express Compact Computer-on-Modules. “OEMs can effortlessly upgrade existing applications by simply exchanging the module, instantly gaining access to cutting-edge AI technologies. Integrating artificial intelligence into x86-based systems has never been more straightforward.”

    Key Features of conga-TC700 COM Express Compact Modules:

    • Powered by Intel Core Ultra processors (code-named Meteor Lake), among the most power-efficient x86 client SoCs in the market.
    • Up to 6 P-Cores and 8 E-Cores support up to 20 threads, enabling the consolidation of distributed devices onto a single platform for enhanced cost-effectiveness.
    • Intel Arc GPU with up to 8 Xe Cores and 128 EUs, capable of handling stunning graphics up to 2x 8K resolution and ultra-fast GPGPU-based vision data processing.
    • Integrated NPU Intel AI Boost for efficient execution of machine learning algorithms and AI inferences.
    • Up to 96 GB DDR SO-DIMM with in-band ECC at 5600 MT/s for power-efficient high data throughput and low latency.

    The modules are backed by Congatec’s robust OEM solution-focused ecosystem, offering efficient cooling solutions, evaluation carrier boards, and real-time hypervisor technology for virtual machine deployments. Additional services include shock and vibration tests, temperature screening, high-speed signal compliance testing, design-in services, and comprehensive training sessions to simplify the utilization of Congatec’s embedded computer technologies. The new conga-TC700 COM Express Compact Type 6 modules support an embedded temperature range from 0 °C to 60 °C, available in standard configurations.

    Himanshu Vaibhav
    Himanshu Vaibhav
    Himanshu Vaibhav is a distinguished Technology Journalist associated with and With expertise in researching, writing, and editing, he demonstrates a deep understanding of technology, particularly in the EV industry. His continuous updates on EV, Automotive, and E-mobility industries reflect his commitment to staying at the forefront of emerging trends.

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