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Yearly Archives: 2021

Driving Next-Generation EV Systems with a Distributed Architecture

ELE Times Research Desk - 0
Electric vehicles (EVs) and hybrid EVs (HEVs) are changing, as are the electronics inside them. The increasing amount of electronics plays a significant role...

Qualcomm Launches Snapdragon 8cx Gen 3 for Mobile Windows PCs

Devendra Kumar - 0
Chipmaker Qualcomm has launched a new ‘Snapdragon 8cx Gen 3’ built on a 5-nm process, packed with features such as 5G connectivity and Artificial Intelligence...

India set to Lead Virtualized 5G Stack Globally

ELE Times News - 0
India has witnessed unprecedented growth in electronics manufacturing in the last five years and the growth rate in the electronics manufacturing sector has been...

Total Economic Impact Study Reveals Ivanti Neurons for Service Management Platform Delivers 365% ROI

ELE Times News - 0
Ivanti, the provider of the Ivanti Neurons automation platform that discovers, manages, secures, and services IT assets from cloud to edge, today announced the results...

Infineon’s AIROC Cloud Connectivity Manager Supports the AWS IoT ExpressLink to Make IoT Product Development Simple and Quick

ELE Times Research Desk - 0
Infineon Technologies AG today announced the company’s new AIROC IFW56810 Cloud Connectivity Manager (CCM) solution that supports the AWS IoT ExpressLink standards and specifications....

Stable Electricity Grids Through Grid-forming Converters

ELE Times Research Desk - 0
Large power stations with their large synchronous generators provide stability in the power grid but are being successively powered down in the course of...

MEMS Microspeakers for the Future of the Mobile Internet

ELE Times Research Desk - 0
The microspeakers for wireless in-ear headphones from Arioso Systems GmbH, a spin-off of the Fraunhofer Institute for Photonic Microsystems IPMS, are up to ten...

Microchip Continues Expansion of Gallium Nitride (GaN) RF Power Portfolio

ELE Times News - 0
Microchip Technology Inc. today announced a significant expansion of its Gallium Nitride (GaN) Radio Frequency (RF) power device portfolio with new MMICs and discrete transistors...

Packaging 101: Mapping the Semiconductor Packaging Process & Trends

Mayank Vashisht - 0
Back in the day, chip packaging used to be a background activity, but times have changed significantly and there are several reasons for that....

Siemens Expands Collaboration with AWS to Facilitate Cloud-Based Digital Transformation for Industry

ELE Times Research Desk - 0
Siemens Digital Industries Software and Amazon Web Services, Inc. (AWS) announces an expansion of their collaboration, which combines Siemens’ deep industry expertise with cloud...
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