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Monthly Archives: February, 2021

ASM Pacific Technology and EV Group join forces

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ASM PACIFIC TECHNOLOGY (ASM) and EV GROUP (EVG) announced the signing of a joint development agreement (JDA) to co-develop die-to-wafer hybrid bonding solutions for...

RP2040 and Pico, first in-house Silicon and Microcontroller from Raspberry Pi

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Raspberry Pi family has grown both upwards, now on its fourth full generation, and outwards with a range of devices from the ultra-low-cost Raspberry...

Expansion in Data Center Solutions with Industry’s First CK440Q-Compliant Clock Generator

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Renesas announced the availability of the low-jitter 9SQ440 clock generator IC designed for next-generation Intel platforms used in high-performance computing and data center applications. The latest...

Dynamic 3D printing process features a Light-Driven Twist

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The speed of light travels faster through air, space and beats the speed of sound. The speed of light is now being used in...

STM32WL5x, The 1st Wireless MCU with Embedded Multi-Modulation LoRa Radio, Now With Dual Core

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ST recently launched the STM32WL5x, a dual-core version of the STM32WL, the first wireless MCU with an embedded Multi-Modulation Radio (LoRa, (G)FSK, (G)MSK, BPSK). The new...

India most attractive centre for R&D, says defence secy

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Defence Secretary Ajay Kumar stated that when Prime Minister Narendra Modi talks about self-reliance in defence it not only centres around sheer manufacturing as...

Robust Superconductivity with Trilayer Graphene: Scientists

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The physics world was set ablaze with the discovery that when an ultrathin layer of carbon, called Graphene, is stacked and twisted to a...

Parking Space Analysis with Artificial Intelligence

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The growth in the number of cars parked in urban areas has a major impact on Public Space. One key consequence of this is...

Rafael, BDL to sign MoU regarding World’s First Soft Kill-Hard Kill Decoy System

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Israel’s Rafael Advanced Defense Systems and India’s Bharat Dynamics Limited (BDL) will be signing a Memorandum of Understanding (MoU) for joint induction of an...

Next-Generation Computing to be influenced by Graphene

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MIT researchers and colleagues have discovered an important—and unexpected—electronic property of Graphene, a material discovered only about 17 years ago that continues to surprise...
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