Monthly Archives: February, 2023

KYOCERA AVX Launches New Circuit Matching Service

The new online tool and global design support service will help customers quickly and confidently select crystal timing devices optimized for their ICs. KYOCERA AVX,...

SiC Modules Enable High Power Energy Infrastructure Design

Power conversion is essential for electronic products, from battery-powered Internet of Things (IoT) sensors to high-power solar inverters. In addition, increasing the use of...

Leading chipset manufacturers test and verify 5G RedCap using R&S CMX500 in R&D and type approval stages

Rohde & Schwarz helps Tier 1 chipset manufacturers around the globe to verify 5G RedCap (Reduced Capabilities) and other 3GPP Release 17 features of...

STMicroelectronics Accelerating Sustainability and move to Carbon Neutral Reduction by creating value and prioritizing people

"People are our biggest asset. But making sustainability part of our DNA and embed it in our everyday decision process are not enough" STMicroelectronics is...

PILOT AOI version 7 offers more Flexibility and Automation

The AOI system software PILOT AOI version 7 offers numerous new functions regarding performance and comfort. Especially with regard to the flexibility when using...

India’s Semiconductor Industry to Reach at Around $100 Billion

The semiconductors industry is growing ever since the advent of electronic products. The Indian semiconductor market was valued at USD 27.2 billion in 2021...

India’s First Hydrogen Truck Launched

RIL in collaboration with Ashok Leyland has come up with Internal Combustion Engine (H2-ICE) powered heavy-duty truck, making it India's first hydrogen truck. The...

Small Form Factor to Complete High-Performance Eco-system

Congatec, a leading vendor of embedded and edge computing technology will be presenting its comprehensive COM-HPC ecosystem at Embedded World 2023 (hall 3 /...

SMT Tooling Partners with The JW Corporation in Canada

SMT Tooling, a division of PSA Systems, announced that it has partnered with The JW Corporation as its newest manufacturer’s representative. Under the agreement,...

Infineon Top-Side Cooling Packages Registered as JEDEC Standard for High-Power Applications

The trends toward higher power density and cost optimization dominate the development goals of efficient high-power applications that create substantial value for segments such...

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