Monthly Archives: April, 2018

Unidirectional TVS Diode Arrays in Smallest Footprint Available Protect I/O and Power Ports from ESD

Littelfuse, Inc., introduced two series of AEC-Q101-qualified, unidirectional TVS Diode Arrays optimized to protect I/O and power ports against electrostatic discharges (ESDs). SP1053 and...

IoT Security: Hardware vs Software

The subject of technology often leads us to the alleys of future. It is a topic that people often indulge in debating. For some,...

New Solder Paste Jetting System Provides Fast, Repeatable Non-Contact Dispensing

Nordson EFD, a Nordson company introduced the new Liquidyn P-Jet SolderPlus jet valve and solder paste system. This non-contactjetting system is designed specifically to jet Nordson EFD SolderPlus dispensing paste with...

Inside Intel: A look at the World’s Cleanest Semiconductor Fab

No dust mops needed here. The inside of a chip factory is cleaner than about any other place you can visit on Earth. To...

Hyderabad can generate 1,730 Mw rooftop solar power

With a potential of 1,730 MW power generation through rooftop solar panels, Hyderabad can become solar champion in India, thereby reduce air pollution by cutting on...

India’s first 5G Lab set up by IIT Delhi

IIT-Delhi (IIT-D) has set up a radio lab with an array of antennas for “standardisation, research and manufacturing” of 5Gequipment, the institute said. “In an effort...

The extremely Small IXXAT INpact M.2

HMS Industrial Networks now adds the M.2 format to the IXXAT INpact PC-card range. The result is the smallest PC-interface for Industrial Ethernet and...

Mouser Electronics Continues Hall of Fame Sponsorship of FIRST Championship

Mouser Electronics, Inc., will sponsor the FIRST Robotics Competition Hall of Fame exhibit at the 2018 FIRST Championship events in Houston and Detroit. Overall,...

MiniMax Series now available with AWG24 Ethernet and IP68 sealing down to 20m/24h

Fischer Connectors, the global connectivity solution provider of high-performance circular connector and cable assemblies, continues to push the boundaries of technological innovation in rugged miniaturization, high-speed data transmission,...

Cybersecurity Remains Biggest Barrier to Fintech and Banking Sector Partnerships in Asia Pacific

Fortinet called for established financial institutions and their fintech partners to jointly address critical cybersecurity needs in order to forge successful collaborations. The general...

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