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Yearly Archives: 2017

LTE, a catalyst for IOT

The Internet of Things (IOT) also known as the industrial Internet is growing at a phenomenal speed these days. LTE which is a core...

CES 2017: Intel Reveals Compute Card for Smart Devices

The compact card is designed to power and upgrade smart devices. Intel has announced a new modular computing platform for connected devices. The Compute Card...

Latest processors boosts module-based high-end embedded computing : Congatec

Congatec has extended its COM Express Basic portfolio with the new high-performance conga-TS175 Computer-on-Module. Equipped with the high-end dual chip versions of the brand...

Kaby Lake: The New Intel i7-7700K

Talking of performance based processors for video editing jobs and gaming, Intel has been on the lead. Is the new Intel i7-7700K processor worth...

STMicroelectronics Advances Single-Chip Telematics/Connectivity Processors to Support Future Connected-Driving Services

STMicroelectronics Advances Single-Chip Telematics/Connectivity Processors to Support Future Connected-Driving Services ST’s ‘Telemaco’ family combines telematics and connectivity functions in the same chip, delivering economical,...

CORSAIR Powers Up CES 2017, with New HX and TX-M Series PSUs Platinum, Gold and SFF breaking the mold

Corsair, a world leader in enthusiast memory, high-performance gaming hardware and PC components on January 6, 2017, announced the immediate availability of the new CORSAIR HX series...

DigitalOcean and Stockroom.io to host an online ‘Women Hack’

This Hackathon is an online coding challenge exclusively for women to identify, support and encourage more women coders DigitalOcean, a cloud platform focused on simplifying...

Industry gears up for INTELECT 2017 & DISTRIBUELEC

IEEMA (Indian Electrical & Electronics Manufacturers’ Association) proudly announces INTELECT 2017 & DISTRIBUELEC, one of its only kind’s exhibition cum conference,to be held from 23rd...

Cypress Semiconductor’s platform for direct HDMI connections

EZ-PD CCG3 controller minimises bill-of-material costs and simplifies designs, replacing multiple discrete components with a single-chip solution. Cypress Semiconductor has announced a platform that enables...

Gigabit-class LTE connectivity now in Snapdragon 835

Qualcomm’s Snapdragon 835 sports a 35% decrease in package size with 25% better power efficiency compared to the existing 821. With a 35% decrease in...

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