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    Anritsu and the University of Texas at Dallas Collaborate to Showcase Orchestration System for OpenROADM/IPoDWDM at OFC 2024

    Anritsu Corporation in collaboration with the University of Texas at Dallas showcased its orchestration system for overall control and monitoring of combined OpenROADM and IPoDWDM networks...

    STSPIN32G4, The 1st motor controller with an integrated MCU solves 2 major challenges

    Author: STMicroelectronics The STSPIN32G4 integrates a three-phase gate driver, an STM32G431, and a power management system under one package to solve major engineering challenges, thus enabling new applications. While...

    Anritsu and NTT Collaborate to Showcase End-to-End 400G Testing for IOWN Open APN at OFC2024

    Anritsu Corporation, in collaboration with NTT, will participate in the "OFCnet" state-of-the-art network demonstration environment at the Optical Fiber Communication Conference and Exhibition 2024...

    Renesas Introduces Industry’s First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core

    RISC-V MCUs Offer Developers a New Low-Power, High-Performance Option Along with Full Toolchain Support Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today...

    Accelerating the Adoption of AI Applications, Nuvoton Technology Introduces an Endpoint AI Product Platform Based on Microcontrollers and Microprocessors

    Nuvoton Technology introduces an endpoint AI platform based on microcontrollers, expanding the AI ecosystem into the microcontroller domain. This solution is based on Nuvoton's...

    Microchip Technology Expands TrustFLEX Family with CEC1736 Real-time Platform Root of Trust Devices

    TrustFLEX devices along with the Trust Platform Design Suite tool will simplify the enablement of the root of trust from concept to production in...

    Vertiv Joins the NVIDIA Partner Network

    Vertiv brings its high-density power and cooling infrastructure expertise to the NVIDIA Partner Network to better support adoption of accelerated computing and AI workloads Vertiv,...

    New SSO10T TSC top-side cooling package for power MOSFETs enables highest efficiency for modern automotive applications

    Infineon Technologies AG introduces the SSO10T TSC package with OptiMOS MOSFET technology. With its direct top-side cooling concept, the package offers excellent thermal performance....

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