Industry News

Industry News

India Mobile Congress

Full-Featured Smartphone Chipset MT6739 Debuts in India Mobile Congress 2017

MediaTek Inc., the Taiwan-based global fabless semiconductor leader, introduced its MT6739 chipset on September 27, 2017, at India Mobile Congress 2017, the first mobile conference of...

How Switzerland Became The Silicon Valley Of Robotics

The Alpine nation is now “the Silicon Valley of robotics," according to Chris Anderson, chief executive of 3D Robotics. Zurich boasts Google’s largest campus outside...
Hitachi and BT

BT and Hitachi Partner to Develop Industrial and Enterprise IoT Solutions

BT, one of the world’s leading providers of communications services and solutions, and Hitachi Vantara, a wholly owned subsidiary of Hitachi Ltd. on September 26,...

Telit Selected by VAIO for Industry’s First 450 Mbps Mobile Data Enabled Notebooks

Single SKU, worldwide solution simplfies logistics, inventory management, and global deployment for OEMs Telit’s new LN94x M.2 mobile data card family supports LTE...

STMicroelectronics Selected Technical Partner of E-Distribuzione for Its New Smart-Meter Platform

Several ST leading-edge components power “Open Meter,” the second-generation smart-meter platform designed and developed by E-Distribuzione, an Enel group company  New agreement continues...
Mouser Electronics

Global Distribution Agreement signed between Mouser Electronics and Aconno

 Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, announces a global distribution agreement with aconno, developers of technology...

Appier Appoints Chief Strategy Officer to Drive Growth

Appier, a leading artificial intelligence (AI) company, announced on September 26, the appointment of Microsoft veteran Sean Chu as Chief Strategy Officer (CSO). Chu...

NI and Innovari Help Grid Operators Improve Utilization, Lower Costs

NI, the provider of platform-based systems that enable engineers and scientists to solve the world’s greatest engineering challenges, announced that a technology collaboration with...
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