High Performance Computing (HPC)

High Performance Computing (HPC)

Buy at Mouser: Speed IoT Time to Market with Digi ConnectCore for i.MX6UL...

Mouser Electronics, Inc., is now stocking the Digi ConnectCore for i.MX6UL Development Kit. The kit is a complete, off-the-shelf single board computer (SBC) built...
Comsol Days 2017, multi-physics

COMSOL Days 2017 Schedule Out, Focus at CAE Democratization

COMSOL, Inc. the leading provider of software solutions for multiphysics modeling and simulation, on January 25, 2017, announced the COMSOL Days schedule for 2017....
avx, chip,

AVX Releases a New Series of 15W Hi-Performance; Low Pass Integrated Thin Film SMD...

The new LP Series filters feature a miniature 2816 chip size with a maximum height of 1mm, exhibit low insertion loss & extremely sharp...
modular computing platform

CES 2017: Intel Reveals Compute Card for Smart Devices

The compact card is designed to power and upgrade smart devices. Intel has announced a new modular computing platform for connected devices. The Compute Card...
Intel Xeon

Latest processors boosts module-based high-end embedded computing : Congatec

Congatec has extended its COM Express Basic portfolio with the new high-performance conga-TS175 Computer-on-Module. Equipped with the high-end dual chip versions of the brand...
NAND technology

Kaby Lake: The New Intel i7-7700K

Talking of performance based processors for video editing jobs and gaming, Intel has been on the lead. Is the new Intel i7-7700K processor worth...

Dell EMC Announces New HPC Services

Dell EMC has announced a new collection of high performance computing (HPC) cloud offerings, software and systems to make more HPC services available to...

Fujitsu Announces Start of Operations for Japan’s Fastest Supercomputer

Fujitsu on December 01, 2016, announced the completion of the Oakforest-PACS supercomputer at the Joint Center for Advanced High Performance Computing (JCAHPC), which is...

Vishay Intertechnology Space-Saving 60 A VRPower Smart Power Stages Increase Accuracy While Simplifying Designs

For Telecom Equipment and Datacenter Servers, Devices Feature Integrated Current and Temperature Monitors in PowerPAK MLP55-32L Package Meeting the need for real-time processor and memory power...

Is Japan Going To Be Next Winner Of The Supercomputer Race?

With its next supercomputer, by the year 2017, for the same power consumption Japan plans to deliver a tenfold increase in computing performance. Japan's Next...